INVESTIGATION ON THE CUTTING MODE AND BEHAVIOR OF SINGLE-CRYSTALLINE SILICON UNDER SINGLE-POINT DIAMOND CUTTING

Different industrial of silicon has grown up in recent years very shar ply. It is possible to use silicon in various shapes and mechanical co nditions. However, a comprehensive knowledge of its behaviour under cu tting process will be necessary for the newer applications. Single Poi nt Diamond Cutting (SPDC) seems to have delightful results in case of obtaining fine surface finish and/or mirror-like surface. In this resp ect we tried to specify machining characteristics of silicon for cutti ng process, cleared the relation-ship between surface roughness, nose radius of cutting tool and feed rate. Single crystalline natural diamo nd was used as a cutting tool. During the experiment, by comparing dif ferent tool nose radii, we could understand that a 5mm nose radius of diamond bite, together with about 2 approximate to 4 mu m/rev of feed rate can produce the best surface roughness. at the same time, it has been observed that, the bigger tool nose radius causes more chatter vi bration in tooling system which leads to deterioration of surface cond ition.