DEVELOPMENT OF THERMALLY STABLE NI-AG INTERCONNECTIONS FOR APPLICATION TO RESISTIVE FILMS

Ni plates coated with a thin film of Sn are interconnected with thick- film Ag conductors at different processing conditions using the isothe rmal solidification technique. The joints thus produced consist of int ermetallic phases and are stable at higher temperatures than their fab rication temperature. Light microscopy and scanning electron microscop y together with wavelength dispersive X-ray analysis of the cross-sect ion of the samples is performed to examine the phase formation at the interfacial regions. Based on these, optimum fabrication parameters fo r producing mechanically strong joints are obtained.