CLASSICAL AND RAPID THERMAL-PROCESS EFFECTS ON OXYGEN PRECIPITATION IN SILICON

Citation
K. Mahfoud et al., CLASSICAL AND RAPID THERMAL-PROCESS EFFECTS ON OXYGEN PRECIPITATION IN SILICON, Journal de physique. III, 5(9), 1995, pp. 1345-1351
Citations number
24
Categorie Soggetti
Material Science","Phsycs, Fluid & Plasmas","Physics, Applied
Journal title
ISSN journal
11554320
Volume
5
Issue
9
Year of publication
1995
Pages
1345 - 1351
Database
ISI
SICI code
1155-4320(1995)5:9<1345:CARTEO>2.0.ZU;2-R
Abstract
We report observations on the effects of Rapid Thermal Annealing (RTA) on oxygen and carbon content of different mono and multicrystalline s ilicon materials. From the comparison between the resulting effects of conventional and rapid thermal annealing, we can deduce that the incr ease of the concentration of interstitial oxygen after a short anneali ng is due to the dissociation and dissolution of some microprecipitate s in silicon, which is significantly affected by the initial oxygen co ntent, thermal history, defects and impurity content.