SOLUTIONS OF THERMOELASTIC CRACK PROBLEMS IN BONDED DISSIMILAR MEDIA OR HALF-PLANE MEDIUM

The two-dimensional thermoelastic crack problem in bonded dissimilar m edia or in a half-plane medium is considered. The proposed method for solving this problem consists of two parts. In the first part, complex potential functions are derived which are enforced to satisfy the con tinuity conditions across the interface. while the second part consist s of the derivation of singular integral equations by introducing the dislocation functions along the crack border which are solved numerica lly. For both half-plane and two bonded half-plane problems associated with an insulated crack, the thermal stress intensity factors are com puted numerically by using the appropriate interpolation formulae. The results compared with those of the homogeneous case given in the lite rature show that the method proposed here is effective, simple and gen eral.