We have developed a precision adhesive that is UV-curable and durable
and has low shrinkage during curing and a low coefficient of thermal e
xpansion. This new adhesive consists of a cycloaliphatic diepoxy aceta
l, a triarylsulfonium-SbF6, an epoxy silane coupling agent and a synth
etic cordierite filler. With an optimized amount of filler, this adhes
ive can be cured completely in about five minutes with less than 2% sh
rinkage by exposure to UV irradiation. The cured adhesive exhibits a l
ow coefficient of thermal expansion of less than 2 x 10(-5)/degrees C,
high glass transition temperatures of 200 degrees C, and excellent du
rability in boiling water and moisture. Thus, the adhesive can replace
welding in the fabrication of optical components that require sub-mic
rometer positioning accuracy.