THERMAL-SHOCK RESISTANCE AND BENDING STRAIN TOLERANCE OF ELECTROPHORETICALLY DEPOSITED BI2SR2CACU2OY AG TAPES/

Citation
Sl. Huang et al., THERMAL-SHOCK RESISTANCE AND BENDING STRAIN TOLERANCE OF ELECTROPHORETICALLY DEPOSITED BI2SR2CACU2OY AG TAPES/, Materials letters, 24(5), 1995, pp. 271-274
Citations number
10
Categorie Soggetti
Material Science","Physics, Applied
Journal title
ISSN journal
0167577X
Volume
24
Issue
5
Year of publication
1995
Pages
271 - 274
Database
ISI
SICI code
0167-577X(1995)24:5<271:TRABST>2.0.ZU;2-7
Abstract
The degradation in 77 K self-field critical current density (J(c)) of electrophoretically deposited Bi-2212/Ag tapes has been evaluated sepa rately for thermal cycling (320-77 K), bending in compression, tension and combined compression-tension. After 11 repetitions of 320-77 K th ermal cycles, J(c) is reduced to 75-80% of its original value. A great er number of cycles resulted in no further degradation. The bending st rain tolerance depends not only on bending strain, but also on the thi ckness of superconducting layers and the sense of bending. The superco nducting layers show greater tolerance to compressive than tensile ben ding strain. Strain tolerance increases as layer thickness decreases. 13 mu m layers can withstand strain of 0.2% without degradation in J(c ).