Jm. Ortion et al., IN-SITU CLEANING OF SIO2-PATTERNED GAAS SURFACE WITH TRISDIMETHYLAMINOARSINE FOR SELECTIVE REGROWTH, JPN J A P 1, 35(12A), 1996, pp. 5964-5968
Trisdimethylaminoarsine (TDMAAs) has been used to clean SiO2-patterned
GaAs surfaces prior to selective regrowth. Under TDMAAs pressure, the
native oxide was completely removed at 480 degrees C which is 110 deg
rees C lower than the temperature of thermal oxide desorption. Compare
d to oxide removal with arsine, the morphology and the purity of the d
eoxidized surface are improved with TDMAAs cleaning. It nas found that
additional ex-situ chemical treatments further improve the cleaning.
With the proper ex-situ preparation and TDMAAs cleaning, secondary ion
mass spectrometry (SIMS) shows the removal of carbon at the regrowth
th interface to levels below the residual carbon concentration, while
oxygen and silicon impurity concentrations are, respectively 7.8 x 10(
11) cm(-2) and 1.7 x 10(11)cm(-2). The carrier depletion at the regrow
th th interface is reduced to 2.6 x 10(11) cm(-2) and contact resistiv
ity is lowered to 2.7 x 10(-6) Ohm . cm2.