ACID-BASE PROPERTIES AND PHENYLPHOSPHONIC ACID COMPLEXATION AT THE AGED GAMMA-AL2O3 WATER INTERFACE

Citation
E. Laiti et al., ACID-BASE PROPERTIES AND PHENYLPHOSPHONIC ACID COMPLEXATION AT THE AGED GAMMA-AL2O3 WATER INTERFACE, Journal of colloid and interface science, 175(1), 1995, pp. 230-238
Citations number
18
Categorie Soggetti
Chemistry Physical
ISSN journal
00219797
Volume
175
Issue
1
Year of publication
1995
Pages
230 - 238
Database
ISI
SICI code
0021-9797(1995)175:1<230:APAPAC>2.0.ZU;2-Y
Abstract
Acid/base properties and phenylphosphonic acid (H(2)L) complexation at the water-suspended-and-aged gamma-Al2O3/water interface have been st udied in 0.1 M Na(CI) medium at 25.0 degrees C in the range 5.0 < -log [H+] < 9.5. Equilibrium measurements were performed as a series of pot entiometric titrations supplemented with spectrophotometric phosphorou s analyses, In the evaluation of the experimental data, the contributi on from electrostatic forces was accounted for by using the constant-c apacitance model. The adsorption of phenylphosphonic acid onto the stu died phase was found to be strong at -log[H+] < 7. Desorption was obse rved when -log[H+] was increased toward 9.5. The specific capacitance was evaluated from data collected in the absence of phenylphosphonic a cid. The model describing the acid/base reactions and phenylphosphonic acid binding onto the studied alumina surface, (= AlOH), is given by the following equilibria, intrinsic constants, specific capacitance, a nd site density: = AlOH + H+ = = AlOH log beta(110(int)) = 7.51 +/- 0. 09 = AlOH = = AlO- + H+ log beta(-110(int)) = - 8.87 +/- 0.11 = AlOH H(2)L = = AlLH + H2O log beta(011(int)) = 9.58 +/- 0.18 = AlOH + H(2) L = = AlL(-) + H+ + H2O log beta(-111(int)) = 2.94 +/- 0.08 = AlOH + H (2)L = = AlLOH(2-) + 2H(+) log beta(-211(int)) = - 5.30 +/- 0.13 C = 1 .40 F m(-2) Site density = 1.03 sites/nm(2) In a series of modeling ca lculations, the complexation features of phenylphosphonic acid are com pared to those of orthophosphoric acid. (C) 1995 Academic Press, Inc.