STUDIES OF POLYIMIDE COPPER INTERFACE AND ITS IMPROVEMENT BY A 2-COMPONENT PRIMER/

The inhibition of the imidization of polyamic acid, a precursor of pol yimide, in the presence of Cu, was confirmed by the incorporation of C U2+ ions in polyamic acid films. It was found that the imidization rea ction was incomplete below 300 OC but decomposition took place when he ating above 300 degrees C. Pretreating the Cu surface with a two-compo nent primer solution containing polybenzimidazole and 2-mercaptobenzim idazole can make the imidization proceed without retardation and avoid the decomposition above 300 degrees C. By choosing appropriate surfac e treatment systems, one can achieve the improvement of adhesion betwe en PI and Cu substrate.