PHYSICAL-PROPERTIES OF PULSED CURRENT COPPER ELECTRODEPOSITS

Square-wave unipolar pulse electroplating and bipolar pulse reverse el ectroplating of copper using an acid copper electrolyte of the type us ed for printed circuit boa rd production has been studied. The effects of pulse-plated coatings on cathode efficiency and on the coatings pr operties, such as surface roughness, microhardness, stress-strain char acteristics and elongation, are reported. The results show that microh ardness, tensile strength and elongation are directly affected by the pulse technique used.