CORRELATION BETWEEN HALL NUMBERS AND T-C IN LESS-THAN-OR-EQUAL-TO-X-LESS-THAN-OR-EQUAL-TO-0.5) THIN-FILMS PREPARED BY RF THERMAL PLASMA DEPOSITION METHOD
H. Yakabe et al., CORRELATION BETWEEN HALL NUMBERS AND T-C IN LESS-THAN-OR-EQUAL-TO-X-LESS-THAN-OR-EQUAL-TO-0.5) THIN-FILMS PREPARED BY RF THERMAL PLASMA DEPOSITION METHOD, JPN J A P 1, 34(9A), 1995, pp. 4754-4759
The temperature dependence of the resistivity and the Hall coefficient
R(H) was measured for Y1-xCaxBa2Cu3O7-delta thin films prepared on Sr
TiO3 substrates using the RF thermal plasma deposition method. Transit
ion temperature T-c and resistivity of the as-grown film decrease with
increasing Ca concentration. However, oxygen treatment affects the tr
ansport properties of the films and a slight increase in oxygen defici
ency delta increases T-c in heavily Ca-doped samples through changes i
n the hole density. There is a maximum T-c of about 90 K with variatio
n of the carrier density and further reduction of the oxygen content l
owers T-c again. The value of the maximum T-c is independent of Ca con
centration and a parabolic relationship between Hall number and T-c ex
ists in the Y1-xCaxBa2Cu3O7-delta system.