A COMPUTATIONAL MODEL FOR FORCED-CONVECTION COOLING IN ELECTRONIC COMPONENTS

This study deals with simulation and modeling of forced convection coo ling in electronic components. A computational model is developed for two-dimensional laminar fluid flow and heat transfer in cooling channe ls formed by stacked printed circuit boards with electronic blocks. Th e computational procedure involves solving two-dimensional continuity, momentum and energy equations with the assumption of periodic fully d eveloped velocity and temperature conditions in the flow direction. A parametric study is carried out to present results for the local and a verage Nusselt number, and friction factor with varying Reynolds numbe r and geometric parameters.