SUPPRESSION OF TRANSIENT ENHANCED DIFFUSION FOLLOWING IN-SITU PHOTOEXCITATION DURING BORON ION-IMPLANTATION

Citation
J. Ravi et al., SUPPRESSION OF TRANSIENT ENHANCED DIFFUSION FOLLOWING IN-SITU PHOTOEXCITATION DURING BORON ION-IMPLANTATION, Applied physics letters, 67(15), 1995, pp. 2158-2160
Citations number
15
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00036951
Volume
67
Issue
15
Year of publication
1995
Pages
2158 - 2160
Database
ISI
SICI code
0003-6951(1995)67:15<2158:SOTEDF>2.0.ZU;2-T
Abstract
The effect of in situ photoexcitation during boron ion implantation on subsequent transient enhanced B diffusion in Si has been investigated . Photoexcitation using a mercury arc lamp was performed during B+ imp lantation at 35 keV for a dose of 5X10(14) cm(-2) at 177 K. A reductio n in the electrical activation dip, i,e., reverse annealing effect, in the temperature range 550-700 degrees C was observed. Also, the trans ient enhanced diffusion of B, measured using SIMS following 800 degree s C, 30 min annealing, was suppressed. Both effects demonstrate that t he creation of self-interstitials during the implantation process is s ignificantly reduced. (C) 1995 American Institute of Physics.