Assembly of ''best-of-breed'' cluster tools from plug-and-play modules
supplied by different equipment manufacturers is made possible by the
standards set by the Semiconductor Equipment and Materials Internatio
nal (SEMI) Modular Equipment Standards Committee (MESC). By complying
with the MESC standards specifying the interfaces to Individual cluste
r modules - services, messages, and mechanical interfaces - these modu
les can become interoperable. To achieve the flexibility required for
application specific integrated circuit (ASIC) production, the MESC st
andard has been implemented in a cluster tool for our Intelligent Modu
lar Fab (IMF) project (Table 1). This approach can benefit every level
of the semiconductor industry, from R&D and production facilities to
equipment suppliers and systems integrators, by increasing flexibility
and reducing development and integration costs.