F. Lavia et al., ARSENIC AND BORON-DIFFUSION IN SILICON FROM IMPLANTED COBALT SILICIDELAYERS, Semiconductor science and technology, 10(10), 1995, pp. 1362-1367
The diffusion from CoSi2 layers, implanted with As and B ions, into th
e underlying Si substrate has been studied by a high-resolution carrie
r delineation technique. In the early stages of diffusion the junction
shape follows the silicide/silicon interface for B, while it is deepe
r near the CoSi2 grain boundaries for As. The different behaviour is r
elated to the different diffusion mechanisms of As and B in the silici
de layer. Using a two-step anneal or a thin silicide diffusion source
a laterally uniform junction has also been obtained for As-implanted C
oSi2. The diffusion coefficients of arsenic and boron in silicon have
been measured by this technique. The measured diffusivity values for b
oron and arsenic are very close to the data reported in the literature
.