FRACTURE-MECHANICS OF A NEW BLISTER TEST WITH STABLE CRACK-GROWTH

A new blister test is proposed to measure the specific work of adhesio n W between a thin flexible film on a rigid substrate. In contrast to the conventional blister loaded by constant fluid pressure which leads to catastrophic crack propagation, the new test is driven by an inter nal expansion of a fixed mass of working gas which leads to stable cra ck growth. The new technique is demonstrated by measuring W of an inte rface with a commercial sticky tape serving as the thin film and alumi nium as the rigid substrate.