WEIGHT VERSUS STRENGTH - A CASE-STUDY

Smart electronic packaging is necessary for solving the problem of pro tecting electronic devices, weight reduction and miniaturization, and many technical problems connected with the performance of these device s. To develop a guideline for these improvements, it is important init ially to create some sound engineering estimates based on simple analy tical considerations. In the present paper, such estimates are constru cted as applied to the design project of the ground based radars (GBR) of the next generation. Some necessary technical requirements for the GBR structure are presented, and an estimate is made of the comparati ve performance of laminate composite materials in the GBR project, as compared to the aluminum alloy of the present GBR design. The menu met hod is suggested to solve the problem of the multi-criterion, optimal design of the panel thickness in the GBR design. Finally, the mechanis m of sintering ceramics in order to control their density and strength , and hydridize them using superelastic SMA actuators against an impac t, is considered.