L. Kloc et al., CREEP-BEHAVIOR OF A NI-15CR SOLID-SOLUTION ALLOY AT LOW STRESSES AND INTERMEDIATE TEMPERATURES, Materials science & engineering. A, Structural materials: properties, microstructure and processing, 202(1-2), 1995, pp. 11-17
Creep in a Ni-15Cr solid solution alloy at low stresses and intermedia
te temperatures was investigated using the helicoidal spring specimen
technique. The applied stress ranged from 0.2 to 5.0 MPa, the testing
temperatures from 973 to 1123 K (homologous temperatures T/T-m from 0.
59 to 0.65, where T-m is the solidus temperature). The intercept grain
size of creep specimens ranged from 47 mu m to 254 mu m. It was found
that under the above conditions, viscous creep of the Bingham type oc
curs, characterized by a low threshold stress which decreases with inc
reasing temperature. The temperature, applied stress and grain-size de
pendence of the steady-state creep strain rate can be interpreted in t
erms of the transition from Coble diffusional creep to Harper-Dorn dis
location creep controlled by dislocation core diffusion.