MAGNETORESISTANCE IN ELECTRODEPOSITED NI-FE-CU CU MULTILAYERS/

Citation
K. Attenborough et al., MAGNETORESISTANCE IN ELECTRODEPOSITED NI-FE-CU CU MULTILAYERS/, Journal of magnetism and magnetic materials, 148(1-2), 1995, pp. 335-336
Citations number
5
Categorie Soggetti
Material Science","Physics, Condensed Matter
ISSN journal
03048853
Volume
148
Issue
1-2
Year of publication
1995
Pages
335 - 336
Database
ISI
SICI code
0304-8853(1995)148:1-2<335:MIENCM>2.0.ZU;2-S
Abstract
Multilayers of Ni-Fe-Cu/Cu have been electrodeposited from a single el ectrolyte onto polycrystalline (100) textured and (100) single crystal copper substrates. Bilayer thicknesses as low as 30 Angstrom have bee n achieved, as confirmed by X-ray diffraction. Room temperature magnet oresistance measurements show the presence of giant magnetoresistance (GMR) and an anisotropic magnetoresistance (AMR) component in the film s.