K. Attenborough et al., MAGNETORESISTANCE IN ELECTRODEPOSITED NI-FE-CU CU MULTILAYERS/, Journal of magnetism and magnetic materials, 148(1-2), 1995, pp. 335-336
Multilayers of Ni-Fe-Cu/Cu have been electrodeposited from a single el
ectrolyte onto polycrystalline (100) textured and (100) single crystal
copper substrates. Bilayer thicknesses as low as 30 Angstrom have bee
n achieved, as confirmed by X-ray diffraction. Room temperature magnet
oresistance measurements show the presence of giant magnetoresistance
(GMR) and an anisotropic magnetoresistance (AMR) component in the film
s.