The low temperature relaxation of epoxy resin modified with siloxane o
ligomers was investigated by using thermally stimulated current (TSC)
and relaxation map analysis (RMA). The beta-relaxation of epoxy resin
and the glass transition temperature of siloxane oligomer were folded
and shifted to higher temperature as the concentration of trifluoropro
pyl (TFP) in siloxane oligomer increased. In the systems containing ov
er 50% of TFP a new relaxation peak due to the dipole orientation was
observed at around -45 degrees C. As the concentration of TFP increase
d the compensation temperature (Tc) and the degree-of-disorder (DOD) w
ere increased while the compensation time, tau c was decreased.