STUDY OF SILOXANE-MODIFIED EPOXY-RESIN USING THERMALLY STIMULATED CURRENT

The low temperature relaxation of epoxy resin modified with siloxane o ligomers was investigated by using thermally stimulated current (TSC) and relaxation map analysis (RMA). The beta-relaxation of epoxy resin and the glass transition temperature of siloxane oligomer were folded and shifted to higher temperature as the concentration of trifluoropro pyl (TFP) in siloxane oligomer increased. In the systems containing ov er 50% of TFP a new relaxation peak due to the dipole orientation was observed at around -45 degrees C. As the concentration of TFP increase d the compensation temperature (Tc) and the degree-of-disorder (DOD) w ere increased while the compensation time, tau c was decreased.