TRANSVERSE ISOTROPIC ELASTIC-MODULI AND INPLANE THERMAL-DIFFUSIVITY IN SILICON-SUPPORTED THIN-FILMS OF A PHOTOSENSITIVE POLYIMIDE MEASURED USING IMPULSIVE STIMULATED THERMAL SCATTERING

Authors
COCSON JK HAU CS LEE PM POON CC ZHONG AH ROGERS JA NELSON KA
Citation
Jk. Cocson et al., TRANSVERSE ISOTROPIC ELASTIC-MODULI AND INPLANE THERMAL-DIFFUSIVITY IN SILICON-SUPPORTED THIN-FILMS OF A PHOTOSENSITIVE POLYIMIDE MEASURED USING IMPULSIVE STIMULATED THERMAL SCATTERING, Polymer, 36(21), 1995, pp. 4069-4075
Citations number
18
Categorie Soggetti
Polymer Sciences
Journal title
Polymer → ACNP
ISSN journal
00323861
Volume
36
Issue
21
Year of publication
1995
Pages
4069 - 4075
Database
ISI
SICI code
0032-3861(1995)36:21<4069:TIEAIT>2.0.ZU;2-8
Abstract
Through impulsive stimulated thermal scattering, the elastic and therm al properties of silicon-supported thin films (2-11 mu m thicknesses) of a new low-CTE (coefficient of thermal expansion) photosensitive pol yimide based on a biphenyl dianhydride/p-phenylenediamine backbone wer e studied. The material was found to be mechanically anisotropic. The in-plane thermal diffusivity and the in-plane and through-plane shear and longitudinal sound speeds were determined.