TRANSVERSE ISOTROPIC ELASTIC-MODULI AND INPLANE THERMAL-DIFFUSIVITY IN SILICON-SUPPORTED THIN-FILMS OF A PHOTOSENSITIVE POLYIMIDE MEASURED USING IMPULSIVE STIMULATED THERMAL SCATTERING
Jk. Cocson et al., TRANSVERSE ISOTROPIC ELASTIC-MODULI AND INPLANE THERMAL-DIFFUSIVITY IN SILICON-SUPPORTED THIN-FILMS OF A PHOTOSENSITIVE POLYIMIDE MEASURED USING IMPULSIVE STIMULATED THERMAL SCATTERING, Polymer, 36(21), 1995, pp. 4069-4075
Through impulsive stimulated thermal scattering, the elastic and therm
al properties of silicon-supported thin films (2-11 mu m thicknesses)
of a new low-CTE (coefficient of thermal expansion) photosensitive pol
yimide based on a biphenyl dianhydride/p-phenylenediamine backbone wer
e studied. The material was found to be mechanically anisotropic. The
in-plane thermal diffusivity and the in-plane and through-plane shear
and longitudinal sound speeds were determined.