Extraordinary adhesion of a Nb-based/Au-Sn metallization structure on
a SiO2/Si substrate has been observed by a tensile pull test. The meta
llization bond fails mostly via fracture through either the Si substra
te or epoxy adhesive. The intrinsic adhesion pull strength of the meta
llization scheme is concluded to be greater than 10 kpsi, and the adhe
sion exceeds the Si-Si cohesive strength. The Nb-Si and Nb-O bonds at
the interface are thermodynamically stable.