BORON IMPLANTATION INTO GAAS GA0.5IN0.5P HETEROSTRUCTURES/

Citation
A. Henkel et al., BORON IMPLANTATION INTO GAAS GA0.5IN0.5P HETEROSTRUCTURES/, JPN J A P 1, 36(1A), 1997, pp. 175-180
Citations number
20
Categorie Soggetti
Physics, Applied
Volume
36
Issue
1A
Year of publication
1997
Pages
175 - 180
Database
ISI
SICI code
Abstract
The electrical effect of implantation of boron ions with energies from 100keV to 360keV into GaAs and Ga0.5In0.5P has been studied. The impl antation dose varied from 5 x 10(11) cm(-2) to 5 x 10(13) cm(-2). Resi stivities higher than 1 x 10(5) Omega cm for both n-type GaAs and n-ty pe GaInP were measured. C-V and breakdown voltage measurements were us ed to characterize the electrical properties of implanted n GaInP. GaI nP appears to be more sensitive to boron implantation than GaAs, and h igher resistivities can be obtained with lower boron doses. Boron impl antation at 200 keV followed by a 10-min annealing (T = 416 degrees C) generates a mid-gap trap level at 1.04 +/- 0.02 eV below the GaInP co nduction band for Q = 2 x 10(12) cm(-2) and a trap level at 0.92 +/- 0 .02 eV for Q = 5 x 10(12) cm(-2). Low-dose boron ion implantation can give rise to a GaInP passivation-like layer.