A REVIEW ON COOLING BY CHANNEL FLOW BOILING FOR ELECTRONIC SYSTEMS

In recent years, direct liquid cooling with phase change has emerged a s one of the most promising thermal management techniques for electron ic systems. A review is made on studies related to direct Liquid cooli ng channel flow for application to electronic systems. The scope cover s how boiling over plain heaters, for which there is more abundant dat a available, as well as protruded heaters and enhanced surfaces, and t he best available correlations are presented. Protruded heaters and en hanced surfaces on the heater generally improve heat transfer. Inconsi stent findings among results in the Literature are reported, and recom mendations for further studies are proposed.