MICRO-APPLICATION OF NON-FILLED ADHESIVES FOR PRECISION ASSEMBLY IN MICROSYSTEMS MANUFACTURING

The precision assembly of microscale components with mechanical, elect rical or optical function in microsystems technology and microelectron ics requires an exact volumetric dispensing technique. Applications in clude mechanical fixation of microstructured components or planes with out an excess of adhesive, sealing of microscale fluidic structures or trimming of resonant mechanical structures in microsystems. Pressure or valve controlled proportioning systems are limited in terms of mini mal proportioning volume to some nanolitres. For low viscous, non-reac tive media, piezomechanical or bubble jet systems can be used to dispe nse picolitre drops. This paper describes picolitre proportioning of r eactive, two-component adhesives using glass capillary tips together w ith a standard pressureized air dispensing unit. A fast sequential pro cess is realized with a pneumatic driven vertical translation and fast x,y-table. Process parameters and process control are discussed in te rms of adhesive rheology and surface wetting. Application results from a mounting process of ink jet printing heads are reported.