EFFECT OF ETCHING WALL PROFILE ON TPC FLYING HEIGHT

Authors
Citation
E. Cha et Jjk. Lee, EFFECT OF ETCHING WALL PROFILE ON TPC FLYING HEIGHT, IEEE transactions on magnetics, 31(6), 1995, pp. 2958-2960
Citations number
2
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189464
Volume
31
Issue
6
Year of publication
1995
Part
1
Pages
2958 - 2960
Database
ISI
SICI code
0018-9464(1995)31:6<2958:EOEWPO>2.0.ZU;2-L
Abstract
The effect of the flying height on the TPC wall profile is studied. Th e different etching techniques to form the TPC steps create different wall profiles. The wall profiles are measured using an AFM. By employi ng the numerical technique developed for the sub-ambient pressure slid ers the wall profile can be modeled correctly. The resulting modeled f lying heights show very good agreement with the measured flying height s. The flying heights are less sensitive to the wall length and wall h eight; thus, the flying heights are less susceptible to the measuremen t uncertainties.