SINGULAR ANTIPLANE STRESS-FIELDS FOR BONDED AND DISBONDED 3-MATERIAL JUNCTIONS

Citation
Ss. Pageau et al., SINGULAR ANTIPLANE STRESS-FIELDS FOR BONDED AND DISBONDED 3-MATERIAL JUNCTIONS, Engineering fracture mechanics, 52(5), 1995, pp. 821-832
Citations number
12
Categorie Soggetti
Mechanics
ISSN journal
00137944
Volume
52
Issue
5
Year of publication
1995
Pages
821 - 832
Database
ISI
SICI code
0013-7944(1995)52:5<821:SASFBA>2.0.ZU;2-7
Abstract
Antiplane shear solutions are given for the asymptotic stress field ar ound an internal point in an elastic, isotropic solid where three wedg es of different materials meet. The three interfaces are either all pe rfectly bonded or a disbond is introduced along one interface. One fea ture of this three-material junction that is not present for the corre sponding two material case, is that each interface is geometrically di fferent, and therefore, the singular behavior is dependent on which in terface is disbonded. Each material and geometrical combination theref ore gives rise to four problems; one with perfect bonding at all inter faces and three cases of an interface disbond. Numerical results are p resented for selected three-material junctions. Numerical results show that singularities can be much more severe in three-material junction s than in two-material junctions. The results also show the importance of providing the associated angular variations of the fields which ca n be drastically different for two cases with very similar geometries and identical orders of singularity.