COERCIVE SM2CO17 POWDER FOR THE BONDED MAGNET APPLICATION

Citation
Wl. Liu et al., COERCIVE SM2CO17 POWDER FOR THE BONDED MAGNET APPLICATION, IEEE transactions on magnetics, 31(6), 1995, pp. 3686-3688
Citations number
9
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied
ISSN journal
00189464
Volume
31
Issue
6
Year of publication
1995
Part
2
Pages
3686 - 3688
Database
ISI
SICI code
0018-9464(1995)31:6<3686:CSPFTB>2.0.ZU;2-5
Abstract
Microstructure of ingots with nominal composition of Sm(Co0.68Cu0.065F exZry)(z), where x=0.25, 0.27 and 0.30, y = 0.01, 0.02 and 0.03 and z varies from 7.9 to 8.3, were examined at various homogenizing temperat ures and magnetic hardening treatments. It was found that the resultin g H-ci is strongly dependent upon the alloy composition and the homoge nizing temperature. In general, the H-ci increases as the homogenizing temperature is raised, peaks at a critical temperature, then decrease s with increasing homogenizing temperature. This critical temperature may coincide with the solidus curve of the liquid + 2:17 --> TbCu7 typ e disordered structure transformation. In general, the single phased m icrostructure achieved after the homogenizing treatment is necessary t o obtain the highest H-ci after magnetic hardening. For a fixed therma l treatment, the H-ci was found to increase with the Zr content.