A detailed investigation of the applicability of Ti/Co bilayers for th
e salicide technology is presented. In the first place the silicide fo
rmation on poly-Si gale lines using Ti/Co bilayers has been studied. I
t is demonstrated that lateral silicide growth over the spacers can be
avoided by making use of a two-step silicidation. In addition, the th
ermal stability of CoSi2 obtained on small poly-Si lines by two-step s
ilicidation of a Ti/Co bilayer has been investigated and compared to t
he thermal stability of CoSi, obtained by standard silicidation of a 2
0 nm Co film. The performance of Ti/Co silicidation with respect to br
idging has been studied making use of a special yield monitor chip wit
h dedicated bridging cells. Similar as for standard Co silicidation, c
lose to 100% yield numbers are obtained for two-step Ti/Co silicidatio
n. Finally, the contact resistance between the silicide and the p(+) a
nd n(+) diffusion areas has been evaluated making use of four terminal
cross-bridge Kelvin resistor structures. Contact resistivity values w
ere calculated to be in the range of 5-6 X 10(-7) Omega . cm(2) for Co
Si2/p(+) contacts and in the range of 1-2 x 10(-7) Omega . cm(2) for C
oSi2/n(+) contacts.