S. Ravesi et al., IMPROVED THERMAL-STABILITY OF COBALT SILICIDE FORMED BY ION-BEAM-ASSISTED DEPOSITION ON POLYSILICON, Applied surface science, 91(1-4), 1995, pp. 19-23
Citations number
7
Categorie Soggetti
Physics, Condensed Matter","Chemistry Physical","Materials Science, Coatings & Films
The thermal stability of thin cobalt silicide films obtained by ion be
am assisted deposition of Co on polycrystalline Si has been studied. A
large improvement has been obtained depositing Co at 470 degrees C wi
th an Ar+ beam energy of 1000 eV: no increase of the sheet resistance
was observed until 1000 degrees C. The improvement has been connected
to the stability of the CoSi2/polysilicon interface.