Se. Schulz et al., EVALUATION OF SELECTIVE TUNGSTEN PLUGS ON TIN, W AND ALSI BY ANALYTICAL AND ELECTRICAL MEASUREMENTS, Applied surface science, 91(1-4), 1995, pp. 326-331
Citations number
13
Categorie Soggetti
Physics, Condensed Matter","Chemistry Physical","Materials Science, Coatings & Films
This paper focuses on the examination of selective tungsten plugs grow
n by silane reduction of WF6 on different base layers (TiN, W, AlSi).
The influence of selected ex situ wet and in situ plasma pretreatments
on the interface formation was estimated and the composition of the p
lugs was analysed by high resolution TEM (HRTEM) investigations at cro
ss-section samples. Via resistance measurements in a two level alumini
um metallization were used to evaluate the electrical contact quality.
Depending on the base layer material alpha-W and beta-W were detected
at different locations of the plug. No interfacial layer was detected
between the CVD-W and TiN, PVD-W and AlSi base layer, respectively, b
y HRTEM at cross-section samples. Small amounts of AlF3 were detected
at the AlSi surface after different pretreatments. Via resistances for
W plugs on TiN and PVD-W were found to be sufficiently low (e.g. belo
w 2 Omega/0.8 mu m via on TiN). For W plugs on AlSi, a hydrogen anneal
ing had to be performed to obtain good contact quality.