The effect of orthophosphate addition (1 mg/L as P) on copper and lead
-tin solder corrosion was monitored using an experimental coupon expos
ure apparatus with measurement by standing water metals analysis, grav
imetric analysis, direct galvanic current metering, and potentiodynami
c scan analysis. Orthophosphate addition appeared to have a significan
t effect on lead-tin solder corrosion although the results of each ana
lysis differed in magnitude. The effect of orthophosphate addition on
copper corrosion was less clear with gravimetric analysis showing a si
gnificant effects, whereas metals release analysis showed only a sligh
t effect.