ULTRAHIGH-VACUUM RAPID THERMAL CHEMICAL-VAPOR-DEPOSITION OF EPITAXIALSILICON ON (100)SILICON .2. CARBON INCORPORATION INTO LAYERS AND AT INTERFACES OF MULTILAYER STRUCTURES
Mk. Sanganeria et al., ULTRAHIGH-VACUUM RAPID THERMAL CHEMICAL-VAPOR-DEPOSITION OF EPITAXIALSILICON ON (100)SILICON .2. CARBON INCORPORATION INTO LAYERS AND AT INTERFACES OF MULTILAYER STRUCTURES, Journal of the Electrochemical Society, 142(11), 1995, pp. 3970-3974
In this study, we have investigated carbon incorporation in epitaxial
Si layers and at interfaces of multilayer epitaxial structures due to
desorption of hydrocarbons from chamber walls at elevated temperatures
. The experiments were conducted in an ultrahigh vacuum rapid thermal
chemical vapor deposition (UHV-RTCVD) reactor. We have investigated ca
rbon contamination as a function of deposition temperature, film growt
h rate, and partial pressure of hydrocarbons. The results show that at
higher deposition temperatures (750 and 800 degrees C) carbon levels
in epitaxial layers are lower compared to levels in layers grown at lo
wer temperatures (650 and 700 degrees C). It is proposed that at highe
r temperatures, the carbon concentration in Si is determined by the ad
sorption-desorption equilibrium and this results in a growth rate inde
pendent incorporation process. At lower temperatures, carbon incorpora
tion is limited by the availability of sites for chemisorption. Site a
vailability is determined by hydrogen coverage on Si during growth, an
d this produces a growth rate dependent incorporation process. Hydroca
rbon desorption from the chamber walls increases with increasing hold
time at elevated temperatures, resulting in a time dependent increase
in the carbon level within epitaxial layers. Carbon contamination at i
nterfaces of multilayer structures was found to depend strongly on the
growth temperature. Higher interfacial carbon levels were obtained fo
llowing growth at higher temperatures when temperature cycling was use
d to start and stop the growth processes. When gas switching was used
for this purpose, interfacial carbon contamination was observed at low
er temperatures (650 and 700 degrees C). This is tentatively attribute
d to loss of hydrogen coverage when Si2H6 is evacuated from the chambe
r for gas switching and inefficient desorption of physisorbed species
from the surface at lower temperatures.