MECHANOSORPTIVE MODIFICATION OF THE SURFACE-LAYERS OF DISPERSED COPPER WITH SURFACTANT ADDITIVES

In the process of the mechanosorptive hydrophobization, dispersed copp er reacts with stearates and a dense film consisting of complex organo metallic compounds is formed at the particle surface. This film preven ts the kinetic oxidation of copper during thermal treatment. The tempe rature of the diffuse oxidation of copper is increased by 100 to 130 K . The mechanosorptive formation of a hydrophobic film is accompanied b y activated diffusion of the fragments of surfactant molecules into th e particle surface layers. The carbon atoms of an organic compounds ar e traced in a particle layer by methods of surface analysis to a depth of 600 Angstrom at dry hydrophobization, and to a depth. of 1500 to 2 000 Angstrom in the presence of water vapor. Under the adopted conditi ons of mechanosorptive treatment, the penetration depth of the polar f ragments of surfactant molecules into the copper layer does not exceed 300 Angstrom.