Rs. Chen et al., THE EFFECTS OF MOISTURE UPON THE OPTIMAL TEMPERATURE PATH OF THE VISCOELASTIC SYMMETRICAL COMPOSITE LAMINATES AFTER POST CURE, Journal of composite materials, 27(16), 1993, pp. 1578-1597
Inheriting previous studies on the optimal cool-down path of the compo
site laminate, this article incorporates the consideration of a new el
ement-humidity-to analyze the residual stresses which develop in a com
posite material laminate after termination of cool down due to further
exposure to humid environment. Computations are performed for AS4/350
2 symmetric balanced cross ply laminate. Hygrothermorheologically simp
le material viscoelastic behavior and the constant expansion coefficie
nts of temperature and moisture are considered and an optimal temperat
ure path is obtained with the aid of variations to yield the minimal v
alue for the average residual stress within the laminate.