PRECISION GRINDING OF SEMICONDUCTOR WAFERS

Authors
HINZEN H RIPPER B
Citation
H. Hinzen et B. Ripper, PRECISION GRINDING OF SEMICONDUCTOR WAFERS, Solid state technology, 36(8), 1993, pp. 53
Citations number
3
Categorie Soggetti
Engineering, Eletrical & Electronic","Physics, Applied","Physics, Condensed Matter
Journal title
Solid state technology → ACNP
ISSN journal
0038111X
Volume
36
Issue
8
Year of publication
1993
Database
ISI
SICI code
0038-111X(1993)36:8<53:PGOSW>2.0.ZU;2-X