Ab. Danilin et al., SPATIAL LOCALIZATION OF THE BURIED ION-BEAM SYNTHESIZED LAYER OF SILICON DIOXIDE INCLUSIONS IN SILICON, Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 82(3), 1993, pp. 431-434
The effects of implantation of O+ ions with an energy of 150 keV and d
ose of 1.2 x 10(17) cm-2 into (100) n-type silicon at different wafer
temperatures have been investigated. After the implantation, the sampl
es were annealed in an Ar flow furnace at 1200-degrees-C for 2 h. The
composition and microstructure were determined using SIMS and XTEM met
hods. It is found that the spatial localization of SiO2 inclusions in
the buried layer can be narrowed by increasing the implantation temper
ature. However, the best spatial localization of the synthesised oxide
precipitates occurs when the implantation temperature is sufficiently
low that an amorphous buried layer is formed. An explanation for this
phenomenon is discussed.