CADMIUM, TIN, AND LEAD ELECTRODEPOSITION IN DIMETHYL FORMAMIDE SOLUTIONS ON ANOTHER METALLIC SUPPORT

Authors
LOJOU E DEVAUD M TROUPEL M PERICHON J
Citation
E. Lojou et al., CADMIUM, TIN, AND LEAD ELECTRODEPOSITION IN DIMETHYL FORMAMIDE SOLUTIONS ON ANOTHER METALLIC SUPPORT, Journal of the Electrochemical Society, 140(8), 1993, pp. 2157-2162
Citations number
32
Categorie Soggetti
Electrochemistry
Journal title
Journal of the Electrochemical Society → ACNP
ISSN journal
00134651
Volume
140
Issue
8
Year of publication
1993
Pages
2157 - 2162
Database
ISI
SICI code
0013-4651(1993)140:8<2157:CTALEI>2.0.ZU;2-4
Abstract
The electrocrystallization of cadmium, tin, or lead at a gold microele ctrode has been studied in DMF solutions. For each deposited metal, th e deposit grew through a 3D-nucleation diffusion-controlled process. T he electroreduction of residual water on these deposits has been analy zed. The influence of the deposit structure on this phenomenom has bee n assessed.