STUDY ON ADHESION AND REMOVAL OF METALLIC IMPURITIES ON A PERFLUOROALKOXY RESIN SURFACE

The adhesion and removal behavior of metallic impurities on a PFA shee t surface was examined with TRXRF analysis. Metals such as Fe and Cu a re strongly adhered, and they can be removed to some extent by SPM or FPM cleaning. The surface metallic concentration of PFA sheets did not increase when they were dipped into UPW or chemicals contaminated wit h metals, therefore it is assumed that metallic impurities do not adhe re to the PFA surface from liquids. Moreover the metallic transfer tes ts showed that a cleaned PFA sheet did not contaminate Si wafers but a n uncleaned sheet polluted the wafer strongly with metallic impurities . Therefore, when PFA molded parts such as wafer carriers and tubes ar e used in wet processing in semiconductor manufacturing, they must be cleaned by SPM or FPM cleaning,