VERTICAL AND LATERAL HOLE ALUMINUM FILLING CHARACTERISTICS EMPLOYING ELECTRON-CYCLOTRON-RESONANCE PLASMA SPUTTERING WITH HIGH MAGNETIC-FIELD

Filling of submicrometer vertical and lateral holes was investigated b y employing ECR (electron cyclotron resonance) aluminum sputtering wit h two times higher magnetic field than the usual condition of 875 G. D eep submicron contact holes with no adhesive metal layer were satisfac torily filled at 350-degrees-C, which was a much lower temperature tha n conventional methods. Buried lateral trenches with 1-mum depth were also completely filled at 300-degrees-C. The filling mechanism is cons idered to be a cooperative effect of an enhanced diffusion by an ion b ombardment effect, and the formation of dense aluminum islands at the inner wall which act as an adhesive layer.