A new method of particle removal from solid surfaces, which will be ca
lled the ''freezing and melting method'', has been proposed. Substrate
s or materials to be cleaned are dipped into a certain liquid (ultrapu
re water with surfactant or methanol), and the liquid is frozen by liq
uid nitrogen and then melted. Submicron particles deposited on substra
tes (Si wafer and slide glass) were found to be effectively removed by
this simple procedure. The main mechanisms of the particle removal ar
e thought to be an expelling effect at the front of freezing (a kind o
f coacervation) and the difference in thermal shrinkage between frozen
liquid and subtsrate.