DEPOSITION OF GRADED ALLOY NITRIDE FILMS BY CLOSED FIELD UNBALANCED MAGNETRON SPUTTERING

The development of a deposition system based on closed field unbalance d magnetron sputter ion plating (uniform deposition and plasma), has g reatly increased the number of complex nitrides that it is possible to routinely deposit. The new alloy nitrides can increase the hardness o f standard TiN by a factor of 2, and can consequently result in longer tool life, In order to maintain high levels of coating to substrate a dhesion, it is necessary to gradually grade the composition of the fil m in the interface region. Grading of an alloy nitride such as TiZrN w ill ensure minimum L(c) scratch adhesion levels of 75 N. The technique can be closely controlled and is very flexible, enabling the changes in composition to be attained with precision.