NEW FLEXIBLE REACTOR DESIGN FOR RESEARCH-AND-DEVELOPMENT PECVD DEPOSITION SYSTEMS

Citation
R. Arendt et al., NEW FLEXIBLE REACTOR DESIGN FOR RESEARCH-AND-DEVELOPMENT PECVD DEPOSITION SYSTEMS, Surface & coatings technology, 59(1-3), 1993, pp. 148-151
Citations number
13
Categorie Soggetti
Material Science
ISSN journal
02578972
Volume
59
Issue
1-3
Year of publication
1993
Pages
148 - 151
Database
ISI
SICI code
0257-8972(1993)59:1-3<148:NFRDFR>2.0.ZU;2-P
Abstract
The choice of a reactor concept is vital for the success of a research project in plasma-enhanced chemical vapour deposition (PECVD). Two re actor designs are introduced. The so-called remote PECVD (RPECVD) desi gn is characterized by the separation of the plasma from the reaction zone. The moving electrode (ME) concept incorporates a parallel plate reactor with adjustable electrode spacing. Examples are presented to d emonstrate applications of the two concepts. Evaluation of a new precu rsor for Si-X (X = C, N(x), O2, etc.) films is accomplished with RPECV D. RPECVD is also suitable for the treatment of sensitive substrates ( III-V semiconductors, plastics). In turn, ME-PECVD should be destined for purposes where two or more process steps have to be combined. An e xample is proposed with a novel intermetal dielectric process.