R. Arendt et al., NEW FLEXIBLE REACTOR DESIGN FOR RESEARCH-AND-DEVELOPMENT PECVD DEPOSITION SYSTEMS, Surface & coatings technology, 59(1-3), 1993, pp. 148-151
The choice of a reactor concept is vital for the success of a research
project in plasma-enhanced chemical vapour deposition (PECVD). Two re
actor designs are introduced. The so-called remote PECVD (RPECVD) desi
gn is characterized by the separation of the plasma from the reaction
zone. The moving electrode (ME) concept incorporates a parallel plate
reactor with adjustable electrode spacing. Examples are presented to d
emonstrate applications of the two concepts. Evaluation of a new precu
rsor for Si-X (X = C, N(x), O2, etc.) films is accomplished with RPECV
D. RPECVD is also suitable for the treatment of sensitive substrates (
III-V semiconductors, plastics). In turn, ME-PECVD should be destined
for purposes where two or more process steps have to be combined. An e
xample is proposed with a novel intermetal dielectric process.