Si atomic layer growth on Si was investigated by heating the surface w
ith a Xe flash lamp in an ultraclean low-pressure environment of SiH4
or Si2H6 gas. In the case of SiH4, about 0.4 atomic layer deposition p
er single flash light shot was observed on Si(100) at a substrate temp
erature of 385-degrees-C and at a SiH4 partial pressure of 500Pa. The
adsorption process of SiH4 can be explained quantitatively by Langmuir
-type adsorption model, assuming that the total adsorption site densit
y is equal to the surface atom density. It was found that the amount o
f adsorbed SiH4 molecules is determined by the balance between adsorpt
ion and desorption of SiH4. In the case of Si2H6, sub-monolayer growth
of Si was observed at a substrate temperature of 320-degrees-C and un
der Si2H6 partial pressure of 300Pa. From the RHEED observation, epita
xial growth of Si films on Si(100) was confirmed to be realized at low
temperatures such as 385-degrees-C and 320-degrees-C by using SiH4 an
d Si2H6, respectively, and the surface flatness of the deposited films
was as good as that of the initial surface.