INITIAL-STAGES OF COPPER ELECTRODEPOSITION IN THE PRESENCE OF ORGANICADDITIVES

Citation
E. Michailova et al., INITIAL-STAGES OF COPPER ELECTRODEPOSITION IN THE PRESENCE OF ORGANICADDITIVES, Electrochimica acta, 38(16), 1993, pp. 2455-2458
Citations number
23
Categorie Soggetti
Electrochemistry
Journal title
ISSN journal
00134686
Volume
38
Issue
16
Year of publication
1993
Pages
2455 - 2458
Database
ISI
SICI code
0013-4686(1993)38:16<2455:IOCEIT>2.0.ZU;2-E
Abstract
The nucleation and growth kinetics of copper crystals electrochemicall y deposited on platinum and tungsten have been studied in the presence of a composite organic additive for bright copper plating. Data were obtained for the exchange current density i0, for the transition coeff icient alpha of the copper ions, for the stationary nucleation rate I( st) and for the size n(k) of the critical copper nucleus.