In this paper we report on the development and performance of the firs
t fully automatic spectroscopic ellipsometer in a production line of i
ntegrated circuits. We describe the problem to be solved by the new eq
uipment (multilayer monitor), combining the advantages of spectroscopi
c ellipsometry, i.e. ultrathin layer measurement and multilayer measur
ement capability, with mass production requirements, i.e. fully automa
tic system with cassette to cassette robot, compatible with clean room
(class 1), operator oriented user friendly software and equipped with
host computer connection. Measurement results, obtained on production
wafers, are discussed in terms of reproducibility, stability and prec
ision of thickness measurements for single layers-oxide, nitride on si
licon or resist on aluminium-and for multilayer stacks-oxide/polysilic
on/oxide on silicon and nitride/oxide/polysilicon/oxide on silicon.