SIO2 THIN-FILM DEPOSITION BY RADIO-FREQUENCY OXYGEN PLASMA-ENHANCED LASER-ABLATION FROM SI

Authors
Citation
Tp. Chen et al., SIO2 THIN-FILM DEPOSITION BY RADIO-FREQUENCY OXYGEN PLASMA-ENHANCED LASER-ABLATION FROM SI, Applied physics letters, 63(18), 1993, pp. 2475-2477
Citations number
17
Categorie Soggetti
Physics, Applied
Journal title
ISSN journal
00036951
Volume
63
Issue
18
Year of publication
1993
Pages
2475 - 2477
Database
ISI
SICI code
0003-6951(1993)63:18<2475:STDBRO>2.0.ZU;2-U
Abstract
A novel process of room temperature deposition of thin SiO2 film by la ser ablation from a c-Si target in a low pressure ( < 5 mTorr) rf oxyg en magnetron plasma background was developed. The gas phase reactions which usually dominate in other high pressure reactive ablation proces ses are suppressed and the energetic particles from the target have go od transport to the substrate in the low pressure background. The surf ace reactions are continuously enhanced after the arrival of Si partic les by the high fluxes of oxygen radicals and ions from the steady sta te magnetron discharge. The deposition of stoichiometric, less disorde r, dense, and water free films are demonstrated.