A novel process of room temperature deposition of thin SiO2 film by la
ser ablation from a c-Si target in a low pressure ( < 5 mTorr) rf oxyg
en magnetron plasma background was developed. The gas phase reactions
which usually dominate in other high pressure reactive ablation proces
ses are suppressed and the energetic particles from the target have go
od transport to the substrate in the low pressure background. The surf
ace reactions are continuously enhanced after the arrival of Si partic
les by the high fluxes of oxygen radicals and ions from the steady sta
te magnetron discharge. The deposition of stoichiometric, less disorde
r, dense, and water free films are demonstrated.