VIBRATION AND DEFLECTION OF A SILICON-WAFER SLICER CUTTING THE CRYSTAL INGOT

Vibration and deflection of a silicon-wafer slicer cutting the crystal ingot is studied analytically. The blade is clamped and then tensione d in the radial direction at the outer boundary. The inner periphery i s under the action of distributed in-plane and lateral slicing loads f rom the workpiece. The stresses from tensioning, spinning, and loading from the workpiece are taken into account in the in-plane stress eval uation of the blade. The solution is obtained by introducing the multi -modal expansion and applying the Galerkin method to the governing equ ation of the blade. Numerical results are presented for an actual SUS 301 blade cutting a 15.24 cm (6 in.) diameter silicon ingot. Results o btained show that the initial tensioning has a significant effect on t he natural frequencies of the blade, while the lateral deflection of t he blade is much affected by the lateral reaction force from the ingot .