The physical properties of BaTio3 films deposited onto (100)-oriented
silicon wafers at a low substrate temperature of 350-degrees-C for fab
ricating silicon-on-insulator (SOI) structures are described. These fi
lms were prepared by rf planar magnetron sputtering using a target of
BaTiO3 ceramic. These films did not exhibit, ferroelectricity, and the
dielectric constant epsilon(s) and the dissipation factor tan delta w
ere about 100 and 0.013, respectively. These films showed a breakdown
field larger than 1 X 10(6) V/cm and were excellent insulators. Thin-f
ilm transistors were fabricated using a silicon film deposited onto th
e BaTiO3 film. The field effect mobility of 34 cm2/Vs was obtained.