EVAPORATIVE COOLING DUE TO A GENTLY DEPOSITED DROPLET

Citation
M. Dimarzo et al., EVAPORATIVE COOLING DUE TO A GENTLY DEPOSITED DROPLET, International journal of heat and mass transfer, 36(17), 1993, pp. 4133-4139
Citations number
22
Categorie Soggetti
Mechanics,"Engineering, Mechanical
ISSN journal
00179310
Volume
36
Issue
17
Year of publication
1993
Pages
4133 - 4139
Database
ISI
SICI code
0017-9310(1993)36:17<4133:ECDTAG>2.0.ZU;2-P
Abstract
The transient thermal behavior of a single water droplet gently deposi ted on the surface of a semi-infinite solid is investigated. A coupled model that solves simultaneously the transient conduction equation fo r the solid and thr liquid to yield the surface temperature and heat f lux distributions as well as the description of the droplet evaporatio n transient is proposed. The predictions of the evaporation time are c ompared with experimental data. An additional model is presented which assumes constant heat flux at the liquid-solid interface. This model provides a closed form solution for the solid surface transient temper ature distribution.